Design for packagability : the impact of bonding and interconnect technologies on the performance of VLSI dies

Author

Peyman Hosseinie Dehkordi

Date of Award

5-1992

Degree Type

Dissertation

Degree Name

Doctor of Philosophy

Major

Electrical Engineering

Major Professor

Don W. Bouldin

Committee Members

Robert Bodenheimer, Joe Googe, David Straight

Abstract

Silicon-on-silicon multichip module (MCM) packaging is maturing rapidly. It offers the integrated circuit (IC) designer a new approach over the conventional packaged IC on the printed circuit board. The bare ICs can now be mounted and interconnected on a silicon substrate for superior system performance. In general, the performance at the system level is a function of the package and the die and can described as:

Performance_system = ƒ (Performance_package + Performance_die) This work looks into the impact of the packaging technology from an IC designer's point of view. This dissertation is focused exclusively on investigating the "Performance_die" term due to a change in packaging technology. As a proof of principle, two image processing chip-sets have been designed with the conventional wire-bond/PCB and flip-chip/MCM packaging in mind. This work demonstrates how the performance of the dies change as they are designed for wire-bond/PCB and flip-chip/MCM technologies. The impact of the bonding/substrate technologies (i.e. wire-bond/PCB and flip-chip/MCM) on the performance of dies are demonstrated quantitatively in the following areas:

- Power

- Size

- Testability

- Cost

Recommended Citation

Dehkordi, Peyman Hosseinie, "Design for packagability : the impact of bonding and interconnect technologies on the performance of VLSI dies. " PhD diss., University of Tennessee, 1992.
https://trace.tennessee.edu/utk_graddiss/10871